Posted in | Device Assembly

Automated Photonic Device Assembly with Modular System Approach

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AssemblyLine systems, which are high-precision, alignment and assembly machine solutions, are developed for automated manufacture (align-and-attach) of photonic devices.

They exclusively integrate flexible attachment configurations and fast-active alignment with a tried and tested software control interface, encompassed in an industry-standard design. Optional modules offer additional features, and the high-end models offer wafer processing capability, optical test modules, and automatic tool changing.

New, next-generation in-line assembly systems from ficonTEC incorporate a redesigned platform (400, 800, 1200, 1600). They come in particular in-line configurations as an all-around and individual production cell for existing production lines. Alternatively, it is also possible to supply them as task-optimized production segments that consist of various distinctly configured systems. In principal, it is possible to visualize even entire production lines.

ficonTEC - Next-generation In-line Photonics Assembly & Test Systems

Software Control

ProcessControlMaster (PCM) from ficonTEC is a process-oriented, user-friendly application software and control interface that is available with all multi-machine configurations and turnkey systems. PCM incorporates an insightful UI with all high-resolution positioning, machine vision, and system management routines needed for reliable and repeatable driving of passive/active alignment and attachment/bonding process hardware. It is also already completely enabled for automated electro-optical test and characterization tasks. It can also operate and monitor single lines, and even sync parallel lines remotely.

Key Features

Fully-automated photonic device assembly
Configurable closed-loop fast-active alignment
High-precision AUTOALIGN multi-axis motion
Multiple chip and wafer handling options
Epoxy dispensing, curing, and shrinkage control

General Tasks and Applications

Pick-and-place
Thermal or UV curing
Precision adhesive dispensing
Chip-to-package assembly
Active mirror align-and-attach
Fiber/FAC/SAC align-and-attach
HPLD module assembly
Active VBG spectral tuning
Hybrid integrated photonics
PICs, silicon photonics

Modular, Flexible and (Re-)Configurable

FAB and HVM-ready — parallelizable and scalable
Sophisticated feed IN/OUT options
Daisy-chain multiple systems for production segments
Single systems slot into existing production lines
Add and/or swap modules for reconfiguration and repurposing
Operate, monitor, and sync parallel lines remotely

	A400	A800	A1200	A1600
Motion System	4-axis alignment	Gantry system with min. 6-axis high-precision alignment*	Gantry system with min. 6-axis high-precision alignment* OR Cantilever system w/o multi-axis system	Cantilever system with min. 6-axis high-precision alignment*


Working Area (max) (w x b x h, mm)	100 x 200 x 200	100 x 300 x 50**	200 x 300 x 50**	200 x 100 x 50**

Handling Options	Single conveyor		Single or dual conveyor
Wafer Capable	No		Up to 6”	Up to 12”
Machine Vision	Standard/dual positioning and observation camera options
Feed Options	Suitable for Jedec or Auer boats, or for customer trays
Software Features	Ergonomic, flexible and powerful process software – extended operator-less control – remote control server option
Physical Features	Rugged steel-base production cell - access door lifts vertically without affecting footprint
Minimum connections	400 VAC (or country specific), air/vacuum, 100 Mbit/s network
Cleanroom compliance	ISO 6***
Dimensions (w x b x h, mm)	400 x 1200 x 1600/2000	800 x 1200 x 1600/2000	1200 x 1200 x 1600/2000	1600 x 1200 x 1600/2000

Weight (typ., kg)	600	1300	1800	2500