Optocap

Optocap provides contact package design and precision assembly services for a wide range of optoelectronic, microelectronic and MEMS devices. We offer end to end backend semiconductor manufacturing from wafer singulation to assembled product.

Our process and design IP and know-how enable our customers to reduce development and manufacturing costs, accelerate time to market and reduce risk with any new product development.

Our expertise in semiconductor packaging solutions spans the full product life-cycle: from design through prototyping, process optimization, product qualification, failure analysis, volume manufacturing and transfer to low-cost volume manufacture.